1）The distance between Ground and resistor should be as shorter as possible. The copper area between Ground and Drain should be as bigger as possible. That is to reduce thermal resistor and add heat dissipation ability
2）Chip bottom with heat sink to have stronger heat dissipation, it is connected to the GND Pin. When design PCB board. In the premise of safe distance, the area between heat sink and copper should be as far as possible area as far as possible.
3）As the total led voltage can effected on power efficiency, wattage and voltage, please pay attention to the led voltage.
4）The output is high voltage, please add electric shock proof design.
